Etch process challenges – a chamber vacuum perspective

To maximise your throughput and protect your process productivity, we need to consider the new etch process challenges from a chamber vacuum perspective.

The ultra-high vacuum environment provided by Edwards STP turbo molecular pumps enable the most advanced semiconductor  processes and tools to overcome the application challenges of new materials, high aspect ratios, atomic layer processes and particle mitigation.

Many of these innovations are available as a service upgrade on the existing install base of STP turbo molecular pumps. This ensures customers can optimise fab productivity both for leading edge products and their existing install base.

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